Development of the Tee Industry n TEE Architecture n TEE standardization by GlobalPlatform (GP), China Communications Standards Association (CCSA) and Telecommunication Terminal Testing Technology Association (TAF) n TEE Compliance Program (GP TEE Certification Scheme)

■Why do smart card manufacturers want to implement lean manufacturing? ■ What is current stage of lean manufacturing for smart cards? ■ What are the prerequisites of lean manufacturing for smart cards? ■ What are the key elements of lean manufacturing for smart cards? ■ What is the plan for the future development of lean manufacturing for smart cards?

How can module costs be lowered even more? We provide a new option: a smaller 6 PIN dual-interface module. We will tell you all about its innovative advantages and the adjustment needed in the card manufacturing process. If you are interested in it, the good news is it will come soon!

■ Special ink enhances visual effect. ■ How can ink better work with card materials and printing facilities to improve card quality and production efficiency? ■ Eco printing, the future trend

While functionality differentiates card products, the physical features can also differentiate them and make them unique. Solid R&D inspires smart card manufacturers with more imagination when it comes to innovative products. Since future applications will have higher and higher requirements for card body material, what kind of problems will we potentially face? How can good material solve these problems? Covestro, former Bayer Material Technology, will answer these questions for you. We will also introduce the latest exciting card materials, as well as the exclusive services and support you can receive from us.